India's semiconductor push entered its second phase on Friday as Union Electronics and Information Technology Minister Ashwini Vaishnaw launched the Semicon 2.0 Web Application Portal in New Delhi, opening applications under three pillars of the Semicon India Programme, the Press Information Bureau (PIB) said.

Source: Press Information Bureau

Applications are now live for Pillar 2, covering semiconductor machines and materials; Pillar 3, for setting up additional fabrication plants; and Pillar 4, for expanding the ATMP and OSAT assembly, testing, marking and packaging ecosystem. Semicon 2.0 is built on six strategic pillars in all, including chip design, research and development, and talent development, and follows the Union Cabinet's approval of a fiscal outlay of Rs 1,27,500 crore under the India Semiconductor Mission.

Vaishnaw said the portal has been designed so that only complete applications can be submitted. 'The purpose of this is that only the extremely serious players should participate in this,' he said at the launch, according to ANI. He added that India's electronics manufacturing has moved beyond basic assembly towards depth across modules, components, materials and advanced technologies.

12 new component projects cleared

Alongside the portal launch, the Ministry of Electronics and Information Technology announced approval for 12 new applications under the Electronics Components Manufacturing Scheme (ECMS), involving projected investments of Rs 7,503 crore, IANS reported. The projects are expected to generate production worth Rs 39,045 crore and create 7,127 direct jobs. Vaishnaw said 50 per cent of the units approved under ECMS are SMEs or MSMEs.

Source: IANS

Rs 1,27,500 croreSemicon 2.0 outlay approved by Cabinet
Rs 7,503 croreInvestment in 12 new ECMS projects
Rs 39,045 croreExpected production from the 12 projects
7,127Direct jobs expected

According to the ministry, 12 semiconductor projects with cumulative investments exceeding Rs 1.64 lakh crore have been approved across six states so far, and five of them had commenced commercial production as of October 2026. The government says the next phase is aimed at building the full chip ecosystem inside India — from design and equipment to fabrication and packaging — rather than relying on imported components.

What happens next

Companies can now apply under Pillars 2, 3 and 4 through the Semicon 2.0 portal. Approvals, plant locations and timelines for the new fabrication and packaging proposals will be announced by the India Semiconductor Mission as applications are processed.